ECCOSTOCK® FPH is a rigid, low dielectric loss, high temperature polyurethane (isocyanate) , two part foam-in-place resin system. Once cured it remains rigid and has high strength at temperatures up to 275°F (135°C) with short time exposure at 325°F (163°C). ECCOSTOCK® FPH is simply the liquid version of the available sheet stock called ECCOSTOCK® SH.
It is primarily used for encapsulation of electronic modules or components, antennas, radome cores and a variety of other structural applications. ECCOSTOCK® FPH can also be used as a thermal barrier in electrical/electronic applications as well as for vibration dampening requirements.
All products in the ECCOSTOCK® FPH series are supplied as two component kits consisting of a Component X (resin) and Component Y (catalyst).
Shipping Note: Due to the hazards of FPH it can ONLY be shipped by trucking companies such as Yellow Freight, G.O.D., New Penn or Roadway. For expedited or air service BAX Global is the only carrier that will transport this material.