ECMP maintains a strong Research & Development lab with the ability to modify standard products or to create new products to serve your needs. Below are our most recent materials that are being researched and developed and some of our newest products that are now being offered.
Low frequency Ultra-High permeability urethane absorbers are being researched for the 10 MHz to 3 GHz range. These materials are thin (.005" to .040") and can be supplied with a peel and stick adhesive (PSA). If you have an application that may have a need for such a material please contact Michael Plante at email@example.com to discuss it further.
Flexible elastomeric dielectric ECCOSTOCK® DES K, - DES K is a tough, flexible silicone rubber sheet with dielectric constants ranging from 2 to 30, available as thin as .010" (.25mm). This material can be supplied with a factory applied peel and stick adhesive (PSA) for easy attachment. If you have an application that may have a need for such a material please contact our application engineers at firstname.lastname@example.org to discuss it further.
Injection moldable materials ECMP has the ability to provide injection molded absorbers and dielectric parts. This allows for low cost manufacturing of simple or complex parts at mid-high volume (typically >1,000 parts/year). In addition to our standard injection moldable materials like ECCOSTOCK® HiK- TPO and ECCOSORB® MF-PPS, ECMP has the ability to custom formulate a moldable material to meet specific electrical or mechanical requirements. If you have an application that may benefit from a molded solution, please contact our application engineers at email@example.com to discuss it further.